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STEC-00911P-TTAu-T200-NS-AlN
The 9 couples, 3.6/3.0 mm × 1.6mm size module which is made of selected high performance ingot to achieve superior cooling performance and greater delta T up to 74 ºC, designed for superior cooling and heating up to 200 ºC applications. If higher operation or processing temperature is required, please specify, we can design and manufacture the custom made module according to your special requirements.
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STP10DF5901H
The STP10DF5901H is a digital infrared thermopile sensor that facilitates the non-contact temperature measurement. Housed in a small TO-5 package with digital interface, the sensor integrates thermopile sensor, amplifier, A/D, DSP, MUX and communication protocol. The STP10DF5901H is factory calibrated in wide temperature ranges: -20℃~85℃ for the ambient temperature and -40℃~380℃ With ±2℃(0-100℃) or ±2% accuracy for the object temperature. The measured temperature value is the average temperature of all objects in the Field of View of the sensor.
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YY-M32B Thermal imager
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YY-M420A
YY-M420A is a high performance non-contact infrared temperature measurement module with long distance.The module has the characteristics of fast response and accurate temperature measurement. The standard 2-wire access mode makes it widely used in industrial, power and other applications requiring high temperature monitoring.
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YY-MDC
The YY-MDC is a digital infrared thermopile sensor that facilitates the non-contact temperature measurement. Housed in a small TO-5 package with digital interface, the sensor integrates thermopile sensor, amplifier, A/D, DSP, MUX and communication protocol.
The YY-MDC is factory calibrated in wide temperature ranges: -40℃~85℃ for the ambient temperature and -20℃~300℃ for the object temperature. The measured temperature value is the average temperature of all objects in the Field of View of the sensor.
The YY-MDC offers a standard accuracy of ±2% around room temperatures. The digital platform supports easy integration. Its low power budget makes it ideal for battery powered applications, including household electrical appliances, environmental monitoring, HVAC, smart home/building control and IOT.
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STP9CF55S
The STP9CF55S infrared thermopile sensor for non-contact temperature measurement is a thermopile sensor having an output signal voltage directly proportional to the incident infrared (IR) radiation power. Thanks to the high uniformity of the output signal over a wide temperature range, the STP9CF55S is convenient for calibration.The STP9CF55S comprising a new type CMOS compatible thermopile sensor chip features good sensitivity, small temperature coefficient of sensitivity as well as high reproducibility and reliability. A high-precision thermistor reference chip is also integrated for ambient temperature compensation.
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STEFC1-01809P-TTAu-T280-AlN
The 18 couples, 2.0/2.7 mm × 2.0mm size module which is made of selected high performance ingot to achieve superior cooling performance and greater delta T up to 70 ºC, designed for superior cooling and heating up to 200℃ applications in photonics. It has maximum 200℃ processing temperature. If higher operation or processing temperature is required, please specify, we can design and manufacture the custom made module according to your special requirements.
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SSLC471M2B79A
Scope • The specification applies to single layer Capacitor. • Type : SSLC471M2B79A Structure • Electrode topside (anode) : AL =3um ±3000A backside (cathode) : Ti /Au =5000A ~ 6000A • Dielectric Constant (SiNx) : 7.5 Size • Chip size (Before dicing) : 0.820 ± 0.02mm * 0.820 ± 0.02mm • Chip size (After dicing) : 0.790 ± 0.03mm * 0.790 ± 0.03mm • Thickness : 0.210 ± 0.015mm • Pattern drawing : per fig.1 Electrical Characteristics
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SSLC122M2A79A
Scope • The specification applies to single layer Capacitor. • Type : SSLC122M2A79A Structure • Electrode topside (anode) : AL =3um ±3000A backside (cathode) : Ti /Au =5000A ~ 6000A • Dielectric Constant (SiNx) : 7.5 Size • Chip size (Before dicing) : 0.820 ± 0.02mm * 0.820 ± 0.02mm • Chip size (After dicing) : 0.790 ± 0.03mm * 0.790 ± 0.03mm • Thickness : 0.210 ± 0.015mm • Pattern drawing : per fig.1 Electrical Characteristics
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SSLC103M1A79A
Scope • The specification applies to single layer Capacitor. • Type : SSLC103M1A79A Structure • Electrode topside (anode) : AL =3um ±3000A backside (cathode) : Ti /Au =5000A ~ 6000A • Dielectric Constant (SiNx) : 7.5 Size • Chip size (Before dicing) : 0.820 ± 0.02mm * 0.820 ± 0.02mm • Chip size (After dicing) : 0.790 ± 0.03mm * 0.790 ± 0.03mm • Thickness : 0.210 ± 0.015mm • Pattern drawing : per fig.1 Electrical Characteristics
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SSLC102M1C80A
Scope • The specification applies to single layer Capacitor. • Type : SSLC102M1C80A Structure • Electrode topside (anode) : AL =3um ±3000A backside (cathode) : Ti /Au =5000A ~ 6000A • Dielectric Constant (SiNx) : 7.5 Size • Chip size (Before dicing) : 0.830 ± 0.02mm * 0.830 ± 0.02mm • Chip size (After dicing) : 0.800 ± 0.03mm * 0.800 ± 0.03mm • Thickness : 0.210 ± 0.015mm • Pattern drawing : per fig.1 Electrical Characteristics
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SPIR02A
Single-channel or dual-channel digital sensor, DOCI single-line communication, external MCU to process the original signal, more flexible and diverse processing methods. In addition to providing 16-bit infrared digital signals, the sensor can be used for waking-up MCU to reduce the MCU power consumption. The sensor can be customized for more flexible features and better results.
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